HomeKey TechnologiesBiCS8

Benefits

  1. Increased Memory Density: Higher storage capacity in a compact design.
  2. Improved Performance: Faster read and write speeds for enhanced responsiveness.
  3. Power Efficiency: Reduced energy consumption for battery-operated devices.
  4. Cost-Effectiveness: Advanced manufacturing techniques lower production costs.

Features

  • Data Centers
  • Consumer Electronics
  • Automotive Systems
  • Industrial Automation
  • Medical Devices
  • Aerospace and Defense

With the advent of Hybrid Bonding (HB) technology, NAND Flash manufacturers are introducing BiCS8 CBA 3D TLC NAND, which offers improved performance and memory density. BiCS8 allows stacking up to 218 layers, and the CBA (CMOS Directly Bonded to Array) method enables separate manufacturing of CMOS and cell array wafers before bonding, resulting in better bit density and faster NAND I/O speeds.

ACPI's adoption of BiCS8 technology enhances capacity, performance, power efficiency, and cost-effectiveness for superior products.